XRF - Plating Thickness Evaluation


X-Ray Fluorescence Spectroscopy (XRF) allows for accurate quality control of printed circuit boards and electronics, by measuring plating thickness non-destructively. It can measure the plating thickness on large and fine-pitch conductors of a variety of plating finishes: tin-lead (Sn-Pb), immersion silver (ImAg), immersion tin (ImSn), electroless nickel immersion gold (ENIG) and thick gold (Au).