STI Electronics Goes to SMTA Houston Expo to Discuss Training Services/Training Materials/Engineering Services

Submitted by Ray Cirimele on 27th of February, 2017 02:44 pm

STI Electronics, Inc., will exhibit at the SMTA Houston Expo & Tech Forum, scheduled to take place Thursday, March 9, 2017 at the Stafford Centre in Houston, TX. Company representatives will discuss STI’s Training Resources and Engineering Services divisions.

STI’s Training Services division develops customized training courses to fit specific training needs. Typically, STI builds these classes around company-specific standards and specifications. STI is an IPC authorized training center for J-STD-001, IPC-A-610, IPC/WHMA-A-620, IPC-A-600 and IPC7711/7721, and provides both Certified IPC Application Specialist (CIS) and Certified IPC Trainer (CIT) courses.

Other courses include basic soldering, wave soldering, ESD training, BGA rework and many more. It also provides operator/inspector training for through-hole and SMT soldering, conformal coating, and training to the requirements of NASA-STD-8739.1 and NASA-STD-8739.4 for Marshall Space Flight Center and its support contractors. In addition to its standardized training program support materials, STI Electronics’ Training Materials division provides unique or custom training materials including Fine Pitch Lead Free Solder Training Kits. STI is an approved distributor for IPC training materials and videos.

STI’s Engineering Services division provides engineering support and specialized contract manufacturing services for the electronics manufacturing industry. From product design and manufacturability analysis to pre-production prototype and development, STI’s Prototype and Development Lab is a full-service design review and preproduction facility. STI’s Microelectronics Lab was established to meet the rising need for advanced systems development and assembly. The Microelectronics Lab specializes in state-of-the-art engineering design including current technologies such as Chip-On-Board (COB) and Multichip Module (MCM) as well as emerging technologies such as Imbedded Component/Die Technology (IC/DT).