Mechanical Test Services

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STI offers an assortment of mechanical test services to characterize assembly materials and evaluate manufacturing process parameters. Mechanical testing capabilities include first-level interconnects, such as bond wire pull testing and die shear, in addition to second-level interconnects, such as SMD shear strength and solder bump shear strength for BGAs, CSPs, and WSPs.

• Bond Strength (Destructive)
• Nondestructive Bond Pull
• Die Shear Strength
• Solder Bump Shear Strength

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