Mechanical Test Services

Mechanical Test Services

STI offers an assortment of mechanical test services to characterize assembly materials and evaluate manufacturing process parameters.  Mechanical testing capabilities include first-level interconnects, such as bond wire pull testing and die shear, in addition to second-level interconnects, such as SMD shear strength and solder bump shear strength for BGAs, CSPs, and WSPs.

  • Bond Strength (Destructive)
  • Nondestructive Bond Pull
  • Die Shear Strength
  • Solder Bump Shear Strength