Microelectronics Assembly

Microelectronics Assembly
  • Semiconductor Packaging
  • Chip & Wire Technology
  • Flip Chip Attachment
  • Mixed Assembly Technology
  • Multichip Modules (MCM)
  • Package-on-Package (PoP)
  • System-in-Package (SiP)
  • Materials Qualification
  • ISO 9001:2008 Certified