STI’s involvement in research and development programs, both in component packaging technologies and electronics assembly manufacturing, has brought about the acquisition of the top people in this field and the installation of the latest and most advanced equipment and design tools. STI is US-based, ITAR registered, and staffed with engineers to design, develop, and assemble a ruggedized electronics assembly in compliance with our customer’s specifications. With experience in Defense, Aerospace, Space, and commercial applications, STI is adept to designing and assembling a product to satisfy our customer’s requirements.
- Schematic Forward Design
- PCB Layout & Design
- System Level Integration
- Size, Weight & Power (SWaP) Reduction
- Design for Manufacturing (DFM)
- Material Optimization